Multiquip Diamond Blade

Tuck Point Blades - Wafer Segmented

Multiquip Diamond Blades

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Quick Overview

  • DRY/WET Cutting - Premium Grade
  • Wafer blade design for lightning fast material removal.
  • Cleans, routs mortar and masonry materials.
  • 1/4 and 3/8 in wafer widths available.
  • Blade Diameters for Right Angle Grinders & Circular Saws.
  • Reference Series: WTK
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Additional Information

Manufacturer: Multiquip Diamond Blades
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